Specialized Book: Component Technologies and Evaluation Guidelines Required in the Beyond 5G/6G Era
Guidelines for the design of materials for Beyond 5G/6G compatibility, explained alongside examples of the development of each material, trends, and evaluation technologies.
- Overview of the market, learning the necessary high-frequency knowledge from the basics for involvement in 5G/6G. - What are the required characteristics and design policies for high performance of each component in preparation for Beyond 5G/6G? ⇒ Shielding materials, electromagnetic wave absorption materials, polyimide resins, materials for printed wiring boards/substrates, 3D printing materials, fluororesin substrates, film materials, resin hardeners, foams, etc. ⇒ What are the necessary conditions for materials such as transmission loss, relative permittivity, dielectric loss tangent, flame retardancy, processability, etc.? What are the selection criteria for materials? ⇒ Composition of components and the reasons for it, design design, manufacturing methods, evaluation results, etc. - Measurement methods for dielectric properties and how to differentiate them, measurement and calculation methods for permittivity/relative permittivity/dielectric loss tangent. - Methods for improving interfacial adhesion and adhesion, technologies for enhancing the adhesion of difficult-to-bond materials through surface treatment, packaging technologies in 5G/6G, etc.
- Company：情報機構
- Price：10,000 yen-100,000 yen
